SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4EBE304EB-EGCF	SAMSUNG	FBGA	23+	1980	View
K4T1G164QF-BCE70JP	SAMSUNG	TSOP	23+	1980	View
K4W2G1646C-HC12	SAMSUNG	BGA	23+	1980	View
K5W2G1HACI-BP50	SAMSUNG	SOP	23+	1980	View
K9F6408U0A-TCBO	SAMSUNG	BGA	23+	1976	View
KA3842BD	SAMSUNG	BGA	23+	1976	View
K9F2G08U0C-SCB0	SAMSUNG	TSOP	23+	1976	View
K9K2G08UOM-YCB0	SAMSUNG	BGA	23+	1976	View
KLMAG2GEAC-B002	SAMSUNG	TSOP	23+	1976	View
KS0070-00	SAMSUNG	TSSOP	23+	1976	View
KM684002BJ-15	SAMSUNG	BGA	23+	1976	View
K4S510432D-UC75	SAMSUNG	BGA	23+	1976	View
K4M56163PN-BG60	SAMSUNG	TSOP-56	23+	1976	View
K4H280838C-TCB0T00	SAMSUNG	BGA	23+	1976	View
K4F15162D-TL60	SAMSUNG	BGA	23+	1976	View
K4T1G064QF-BCF8	SAMSUNG	NA	23+	1976	View
K4S641632H-TL75	SAMSUNG	BGA	23+	1976	View
K4FHE3D4HM-MGCJ	SAMSUNG	BGA	23+	1976	View
K5L6631CAA-D270	SAMSUNG	BGA	23+	1976	View
K4S281632K-UC60000	SAMSUNG	FBGA	23+	1976	View