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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4F8E304HB-MGCJ K4F8E304HB-MGCJ K4F8E304HB-MGCJ SAMSUNG TSOP44 23+ 2080 View
KFG8GH6U4M-AIB6 KFG8GH6U4M-AIB6 KFG8GH6U4M-AIB6 SAMSUNG SOJ 23+ 2080 View
K9GAG08U0D-PIB0 K9GAG08U0D-PIB0 K9GAG08U0D-PIB0 SAMSUNG FBGA 23+ 2080 View
K6T4008C1B-GB55 K6T4008C1B-GB55 K6T4008C1B-GB55 SAMSUNG SOJ44 23+ 2080 View
K3PE7E700M-XGC1 K3PE7E700M-XGC1 K3PE7E700M-XGC1 SAMSUNG SOJ44 23+ 2080 View
K7M163625M-QC10 K7M163625M-QC10 K7M163625M-QC10 SAMSUNG SOJ 23+ 2080 View
K521F57ACC-B050 K521F57ACC-B050 K521F57ACC-B050 SAMSUNG SOJ36 23+ 2080 View
K4S161622D-TC70 K4S161622D-TC70 K4S161622D-TC70 SAMSUNG SOJ-32 23+ 2079 View
K4G163222A-PC70 K4G163222A-PC70 K4G163222A-PC70 SAMSUNG SOJ44 23+ 2079 View
K4V1H303PC-XGC6 K4V1H303PC-XGC6 K4V1H303PC-XGC6 SAMSUNG SOJ36 23+ 2079 View
K4B8G1646B-MIKO K4B8G1646B-MIKO K4B8G1646B-MIKO SAMSUNG TSOP 23+ 2079 View
K4B1G0846E-HCK0 K4B1G0846E-HCK0 K4B1G0846E-HCK0 SAMSUNG SOJ-32 23+ 2079 View
K4B2G1646F-BCNB K4B2G1646F-BCNB K4B2G1646F-BCNB SAMSUNG TSOP 23+ 2079 View
K4D553238F-VC36 K4D553238F-VC36 K4D553238F-VC36 SAMSUNG SOJ 23+ 2079 View
K9F4G08U0A-IIB0 K9F4G08U0A-IIB0 K9F4G08U0A-IIB0 SAMSUNG TSOP 23+ 2076 View
K4T1G084QJ-BCF7 K4T1G084QJ-BCF7 K4T1G084QJ-BCF7 SAMSUNG SOJ32 23+ 2076 View
KMJJS000WM-B409 KMJJS000WM-B409 KMJJS000WM-B409 SAMSUNG TSSOP 23+ 2072 View
KM41C256P-8 KM41C256P-8 KM41C256P-8 SAMSUNG SOJ44 23+ 2072 View
K9K8G08U0D-SCB0 K9K8G08U0D-SCB0 K9K8G08U0D-SCB0 SAMSUNG SOJ32 23+ 2072 View
KAG00K007M-DGG2 KAG00K007M-DGG2 KAG00K007M-DGG2 SAMSUNG SOJ44 23+ 2072 View