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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
KMQN1000SM-B316 KMQN1000SM-B316 KMQN1000SM-B316 SAMSUNG BGA 23+ 2328 View
K9F4008W0A-TCB0 K9F4008W0A-TCB0 K9F4008W0A-TCB0 SAMSUNG TSSOP 23+ 2328 View
K4N1G164QF-BC20 K4N1G164QF-BC20 K4N1G164QF-BC20 SAMSUNG TSSOP48 23+ 2328 View
KM44C4000CS-6 KM44C4000CS-6 KM44C4000CS-6 SAMSUNG TSSOP 23+ 2328 View
K6X4008C1C-GB70 K6X4008C1C-GB70 K6X4008C1C-GB70 SAMSUNG TSOP48 23+ 2328 View
KMFJ2007M-B214 KMFJ2007M-B214 KMFJ2007M-B214 SAMSUNG TSOP 23+ 2324 View
K9F4G08U0D-SCB0 K9F4G08U0D-SCB0 K9F4G08U0D-SCB0 SAMSUNG BGA48 23+ 2324 View
K4S560832E-UC75 K4S560832E-UC75 K4S560832E-UC75 SAMSUNG TSOP40 23+ 2324 View
K4H641638Q-LCCC K4H641638Q-LCCC K4H641638Q-LCCC SAMSUNG SOP 23+ 2324 View
K4N56163QG-ZC25 K4N56163QG-ZC25 K4N56163QG-ZC25 SAMSUNG SOJ32 23+ 2324 View
K4H561638F-UCCC K4H561638F-UCCC K4H561638F-UCCC SAMSUNG TSOP48 23+ 2324 View
K4H511638F-LCCC K4H511638F-LCCC K4H511638F-LCCC SAMSUNG BGA63 23+ 2324 View
K4B2G0446C-HCH9 K4B2G0446C-HCH9 K4B2G0446C-HCH9 SAMSUNG TSOP 23+ 2324 View
K4B2G0846D-HCKO K4B2G0846D-HCKO K4B2G0846D-HCKO SAMSUNG TSOP48 23+ 2324 View
K4D551638F-TC50 K4D551638F-TC50 K4D551638F-TC50 SAMSUNG DIP 23+ 2324 View
K4H561638F-UCB3 K4H561638F-UCB3 K4H561638F-UCB3 SAMSUNG BGA 23+ 2324 View
KM41C1000P-10 KM41C1000P-10 KM41C1000P-10 SAMSUNG FBGA 23+ 2320 View
K9GAG08U0D-PCB0 K9GAG08U0D-PCB0 K9GAG08U0D-PCB0 SAMSUNG BGA 23+ 2320 View
KM2V8001CM-B707 KM2V8001CM-B707 KM2V8001CM-B707 SAMSUNG BGA366 23+ 2320 View
KAD070300B-TLLL KAD070300B-TLLL KAD070300B-TLLL SAMSUNG BGA 23+ 2320 View