SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K9F1G08U0D-SCB0	SAMSUNG	BGA	23+	2040	View
K9GAG08U0M-PCB0	SAMSUNG	BGA	23+	2040	View
K4H641638Q-LCCC	SAMSUNG	BGA	23+	2037	View
K4T51083QE-ZCE7	SAMSUNG	BGA	23+	2037	View
K4H561638H-UCCC	SAMSUNG	NA	23+	2037	View
K4J52324QH-HJ08	SAMSUNG	BGA	23+	2037	View
K4B4G0846D-BCK0	SAMSUNG	TSSOP	23+	2037	View
K4B2G1646E-BCKO	SAMSUNG	BGA	23+	2037	View
K4D261638E-TC36	SAMSUNG	bga	23+	2037	View
KMR2W000AM-A803	SAMSUNG	TSOP54	23+	2036	View
K9F4G08UOA	SAMSUNG	BGA	23+	2036	View
K8P5516UZB-PI4E	SAMSUNG	BGA	23+	2036	View
K9HBG08U1A-PCBO	SAMSUNG	TSOP	23+	2036	View
KAL00R00QM-D1YY	SAMSUNG	TSSOP	23+	2036	View
K9LBG08U1M-IIBO	SAMSUNG	TSOP	23+	2036	View
K9F5608UOD-JIBO	SAMSUNG	TSOP	23+	2036	View
K9GAG08U0E-SIBO	SAMSUNG	TSSOP-54	23+	2036	View
KST3906-MTF	SAMSUNG	TSOP	23+	2036	View
K6F4016E-EF70	SAMSUNG	BGA	23+	2036	View
K6T1008V2C-TB70	SAMSUNG	BGA178	23+	2036	View

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