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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K6R4008C1D-KI10 K6R4008C1D-KI10 K6R4008C1D-KI10 SAMSUNG BGA 23+ 2292 View
K4H510838C-ZCB3 K4H510838C-ZCB3 K4H510838C-ZCB3 SAMSUNG BGA 23+ 2292 View
K4E641612D-TC50 K4E641612D-TC50 K4E641612D-TC50 SAMSUNG BGA 23+ 2292 View
K4S280832F-UC75 K4S280832F-UC75 K4S280832F-UC75 SAMSUNG BGA 23+ 2289 View
K4H510838J-LCCC K4H510838J-LCCC K4H510838J-LCCC SAMSUNG BGA 23+ 2289 View
K4H511638C-UCCC K4H511638C-UCCC K4H511638C-UCCC SAMSUNG BGA 23+ 2289 View
K4T1G164QQ-HCE6 K4T1G164QQ-HCE6 K4T1G164QQ-HCE6 SAMSUNG BGA 23+ 2289 View
K4B4G1646Q-HKK0 K4B4G1646Q-HKK0 K4B4G1646Q-HKK0 SAMSUNG BGA 23+ 2289 View
K4B1G0446F-HCF8 K4B1G0446F-HCF8 K4B1G0446F-HCF8 SAMSUNG BGA 23+ 2289 View
K4D263238F-QC40 K4D263238F-QC40 K4D263238F-QC40 SAMSUNG BGA 23+ 2289 View
K9F5608M0DPCBO K9F5608M0DPCBO K9F5608M0DPCBO SAMSUNG BGA 23+ 2288 View
KLM8G1GEND-B031 KLM8G1GEND-B031 KLM8G1GEND-B031 SAMSUNG BGA 23+ 2288 View
K4S560432B-TC1L K4S560432B-TC1L K4S560432B-TC1L SAMSUNG BGA 23+ 2288 View
KC2520B24.0000C1HEYG KC2520B24.0000C1HEYG KC2520B24.0000C1HEYG SAMSUNG BGA 23+ 2288 View
K9F1208U0B-JIB0 K9F1208U0B-JIB0 K9F1208U0B-JIB0 SAMSUNG BGA 23+ 2288 View
K6X4008C1F-GF55 K6X4008C1F-GF55 K6X4008C1F-GF55 SAMSUNG BGA 23+ 2288 View
K5G1257ATA-SF75 K5G1257ATA-SF75 K5G1257ATA-SF75 SAMSUNG BGA 23+ 2288 View
K9F2808UOC-YCBO K9F2808UOC-YCBO K9F2808UOC-YCBO SAMSUNG BGA 23+ 2284 View
KFG1G16U2C-AIB6 KFG1G16U2C-AIB6 KFG1G16U2C-AIB6 SAMSUNG BGA 23+ 2284 View
K4H561638F-UCB0TM0 K4H561638F-UCB0TM0 K4H561638F-UCB0TM0 SAMSUNG BGA 23+ 2284 View