SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K6X4008C1C-GB70	SAMSUNG	TSOP48	23+	2328	View
KMFJ2007M-B214	SAMSUNG	TSOP	23+	2324	View
K9F4G08U0D-SCB0	SAMSUNG	BGA48	23+	2324	View
K4S560832E-UC75	SAMSUNG	TSOP40	23+	2324	View
K4H641638Q-LCCC	SAMSUNG	SOP	23+	2324	View
K4N56163QG-ZC25	SAMSUNG	SOJ32	23+	2324	View
K4H561638F-UCCC	SAMSUNG	TSOP48	23+	2324	View
K4H511638F-LCCC	SAMSUNG	BGA63	23+	2324	View
K4B2G0446C-HCH9	SAMSUNG	TSOP	23+	2324	View
K4B2G0846D-HCKO	SAMSUNG	TSOP48	23+	2324	View
K4D551638F-TC50	SAMSUNG	DIP	23+	2324	View
K4H561638F-UCB3	SAMSUNG	BGA	23+	2324	View
KM41C1000P-10	SAMSUNG	FBGA	23+	2320	View
K9GAG08U0D-PCB0	SAMSUNG	BGA	23+	2320	View
KM2V8001CM-B707	SAMSUNG	BGA366	23+	2320	View
KAD070300B-TLLL	SAMSUNG	BGA	23+	2320	View
KFG1216U2A-DIB5	SAMSUNG	BGA	23+	2320	View
KMF820012M-B305	SAMSUNG	FBGA/216	23+	2320	View
K9LBG08U0D-PCK0	SAMSUNG	BGA	23+	2320	View
K9WAG08U1F-SIB0	SAMSUNG	FBGA	23+	2320	View

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