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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
K4B2G1646E-BCMA K4B2G1646E-BCMA K4B2G1646E-BCMA SAMSUNG QFP 23+ 3570 View
KS88C8016-04 KS88C8016-04 KS88C8016-04 SAMSUNG DIP30 23+ 3564 View
K6F1616U6C-XF70 K6F1616U6C-XF70 K6F1616U6C-XF70 SAMSUNG DIP 23+ 3564 View
K4T1G084QE-HCE8 K4T1G084QE-HCE8 K4T1G084QE-HCE8 SAMSUNG BGA 23+ 3563 View
K4E8E304ED-EGCC K4E8E304ED-EGCC K4E8E304ED-EGCC SAMSUNG LQFP-44 23+ 3563 View
K4S561632H-UC75 K4S561632H-UC75 K4S561632H-UC75 SAMSUNG QFP 23+ 3563 View
K4B1G0846G-BYH9 K4B1G0846G-BYH9 K4B1G0846G-BYH9 SAMSUNG QFP 23+ 3563 View
K4B2G1646B-HCK0 K4B2G1646B-HCK0 K4B2G1646B-HCK0 SAMSUNG QFP 23+ 3563 View
K4B2G0846F-BYK0 K4B2G0846F-BYK0 K4B2G0846F-BYK0 SAMSUNG QFP 23+ 3563 View
K4D26323QG-GC33 K4D26323QG-GC33 K4D26323QG-GC33 SAMSUNG BGA 23+ 3563 View
K522H1HACD-B060 K522H1HACD-B060 K522H1HACD-B060 SAMSUNG BGA 23+ 3560 View
K8D1616UBM-FI10 K8D1616UBM-FI10 K8D1616UBM-FI10 SAMSUNG DIP30 23+ 3552 View
K9F4G08U0F-5CB0 K9F4G08U0F-5CB0 K9F4G08U0F-5CB0 SAMSUNG QFP 23+ 3552 View
K5A4G2GQCM-B019 K5A4G2GQCM-B019 K5A4G2GQCM-B019 SAMSUNG QFP100 23+ 3552 View
K5D1258DCA-A090 K5D1258DCA-A090 K5D1258DCA-A090 SAMSUNG BGA 23+ 3536 View
K3RG3G30MM-MGCH K3RG3G30MM-MGCH K3RG3G30MM-MGCH SAMSUNG BGA 23+ 3536 View
K7B801825B-PC65 K7B801825B-PC65 K7B801825B-PC65 SAMSUNG QFP 23+ 3536 View
KFG1G16U2C-AIB6000 KFG1G16U2C-AIB6000 KFG1G16U2C-AIB6000 SAMSUNG QFP-160 23+ 3528 View
K6X1008C2D-TB70 K6X1008C2D-TB70 K6X1008C2D-TB70 SAMSUNG SOP20 23+ 3528 View
K4B4G0846Q-HCK0 K4B4G0846Q-HCK0 K4B4G0846Q-HCK0 SAMSUNG QFP 23+ 3528 View