SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K8D6316UTM-PI07	SAMSUNG	DIP-18	23+	2468	View
KM62256DLG-7	SAMSUNG	BGA153	23+	2468	View
K9G4G08U0M-PCB0	SAMSUNG	BGA	23+	2468	View
K9F8G08U0M-PIBO	SAMSUNG	TSOP	23+	2468	View
KM44C256CP-7	SAMSUNG	BGA	23+	2468	View
K9K8G08U0A-PCB0	SAMSUNG	BGA	23+	2468	View
K6F1616U6A-EF55	SAMSUNG	BGA137	23+	2468	View
K6T0808C1D-TB70	SAMSUNG	BGA48	23+	2468	View
K6X0808C1D-DF55	SAMSUNG	BGA	23+	2468	View
K6R1008C1C-JC15	SAMSUNG	DIP	23+	2468	View
K4S643232H-TC60	SAMSUNG	BGA	23+	2468	View
K4H510838D-ZCCC	SAMSUNG	TSOP	23+	2468	View
K4J55323QG-BC14	SAMSUNG	FBGA	23+	2468	View
KM41C1000BP-8	SAMSUNG	DIP-16	23+	2464	View
K9F1208U0B-PCB0	SAMSUNG	SMD	23+	2464	View
K4T1G084QE-HCF7	SAMSUNG	SOP	23+	2464	View
KA100H019M-BJYY	SAMSUNG	SOP	23+	2464	View
K9G4G08UOM-PCBO	SAMSUNG	TSOP	23+	2464	View
K6X4008C1F-GB55	SAMSUNG	TSOP48	23+	2464	View
K5L3316CAM-D770	SAMSUNG	SOP	23+	2464	View

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