SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
3F880AXZZ-QZ8A	SAMSUNG	QFP	23+	3360	View
CL43B105KBFNNNF	SAMSUNG	QFP208	23+	3346	View
CL03A474MR3NNXH	SAMSUNG	DIP32	23+	3320	View
CIL10J2R2KNC	SAMSUNG	SOP16	23+	3320	View
LJ13-02835A	SAMSUNG	BGA	23+	3312	View
SEMS16-LF	SAMSUNG	BGA	23+	3312	View
CL31C333JBHNNWE	SAMSUNG	new	23+	3311	View
S3C7335XE0-C0C5	SAMSUNG	SOP	23+	3296	View
CL03C390JA3NNNC	SAMSUNG	BGA	23+	3296	View
CIG22B4R7MNE	SAMSUNG	DIE	23+	3296	View
S5L8420X01	SAMSUNG	QFP	23+	3264	View
S3C7054DM2-S074	SAMSUNG	SSOP20	23+	3264	View
CL21B105KONE	SAMSUNG	DIP30	23+	3264	View
CL10C090DB8NNNC	SAMSUNG	QFN-64P	23+	3264	View
S3P9228AZZ-QZ88	SAMSUNG	LCC	23+	3264	View
CL32B475KCVZW6E	SAMSUNG	BGA	23+	3234	View
CL10B223KBNC	SAMSUNG	SOP	23+	3213	View
CL21X226MQQNNNE	SAMSUNG	BGA	23+	3213	View
AH09-00006E	SAMSUNG	SOP20	23+	3212	View
S1A2209A01-D0B0	SAMSUNG	QFP44	23+	3212	View