SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL10B684KO8NNNC	SAMSUNG	BGA	23+	2920	View
AMAN402012SS119	SAMSUNG	SOJ	23+	2916	View
TCSCS1D225MAAR	SAMSUNG	DIP-32	23+	2912	View
CL10C8R2CB8NNNC	SAMSUNG	TSOP	23+	2912	View
TCSCS1C336MBAR	SAMSUNG	FBGA	23+	2908	View
TCSCN1E475MCAR	SAMSUNG	DIP	23+	2904	View
SLTRGB32069NSSWS	SAMSUNG	BGA	23+	2904	View
SWL-2700S	SAMSUNG	BGA	23+	2900	View
CL31B475KOHVPNE	SAMSUNG	BGA	23+	2898	View
SSD2004ATF	SAMSUNG	BGA	23+	2896	View
SFR942PY002	SAMSUNG	BGA	23+	2892	View
SFR942PY002	SAMSUNG	TSOP48	23+	2888	View
S2D0S01B01-J030	SAMSUNG	SSOP	23+	2884	View
S3F84H5XZZ-AV95	SAMSUNG	BGA	23+	2884	View
CL21A475KPFNNNE	SAMSUNG	TSOP	23+	2884	View
PO1203NB	SAMSUNG	PDIP	23+	2880	View
S3F84U8XZZ-QZ88	SAMSUNG	BGA	23+	2880	View
CL32A106KLULNN	SAMSUNG	BGA	23+	2877	View
M378A1K43DB2-CTD	SAMSUNG	TSOP	23+	2876	View
B-47UF-6.3V	SAMSUNG	TSOP-48	23+	2872	View

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