SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K9K2G08UOM-PIBO	SAMSUNG	BGA	23+	1716	View
KM41C464P-8	SAMSUNG	TSOP66	23+	1716	View
KAL009001M-D1YY	SAMSUNG	TSOP	23+	1716	View
K9F5608UOC-DIBO	SAMSUNG	TSOP66	23+	1716	View
K4H511638C-UCB3	SAMSUNG	BGA	23+	1716	View
K4T51163QC-ZCD5	SAMSUNG	BGA54	23+	1716	View
K4A4G165WE-BITD	SAMSUNG	BGA	23+	1716	View
K4S641632K-UC60	SAMSUNG	FBGA	23+	1716	View
K4G41325FC-HC03	SAMSUNG	TSSOP66	23+	1716	View
K4S281632C-TL1L	SAMSUNG	TSOP	23+	1716	View
K4M51163PE-BG75	SAMSUNG	TSOP54	23+	1716	View
K7R161882B-FC16	SAMSUNG	BGA	23+	1716	View
K521F57ACM-A060	SAMSUNG	FBGA	23+	1716	View
K5N2866ABB-ATBD	SAMSUNG	TSOP	23+	1716	View
KMK7U000VM-B309	SAMSUNG	FBGA	23+	1712	View
K4F160411D-FC60	SAMSUNG	FBGA	23+	1712	View
KM68V1000CLTI-7L	SAMSUNG	BGA	23+	1708	View
K4E640812E-TC60	SAMSUNG	BGA	23+	1708	View
K9F4G08U0E-SCB0000	SAMSUNG	TSOP54	23+	1704	View
K4S641632H-TC70	SAMSUNG	FBGA60	23+	1704	View

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