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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
KA900B035M-B8AA KA900B035M-B8AA KA900B035M-B8AA SAMSUNG TSOP44 23+ 2056 View
KS56C220-RV KS56C220-RV KS56C220-RV SAMSUNG SOJ36 23+ 2056 View
KAT00M015A-ARTT KAT00M015A-ARTT KAT00M015A-ARTT SAMSUNG SOJ36 23+ 2056 View
K9G8G08U0A-PCBO K9G8G08U0A-PCBO K9G8G08U0A-PCBO SAMSUNG SOJ32 23+ 2056 View
KLMAG2GEUF-B04Q KLMAG2GEUF-B04Q KLMAG2GEUF-B04Q SAMSUNG SOJ44 23+ 2056 View
K7I321882M-FC20 K7I321882M-FC20 K7I321882M-FC20 SAMSUNG SOJ-44 23+ 2056 View
K6F2016U4E-EF55 K6F2016U4E-EF55 K6F2016U4E-EF55 SAMSUNG TSOP44 23+ 2056 View
K6T4008C1C-VB70 K6T4008C1C-VB70 K6T4008C1C-VB70 SAMSUNG TSOP 23+ 2056 View
K6X4008T1F-VB55 K6X4008T1F-VB55 K6X4008T1F-VB55 SAMSUNG SOP32 23+ 2056 View
K6R1008C1C-JC12 K6R1008C1C-JC12 K6R1008C1C-JC12 SAMSUNG SOJ-36 23+ 2056 View
K4X51163PE-FGC3 K4X51163PE-FGC3 K4X51163PE-FGC3 SAMSUNG TSSOP 23+ 2056 View
K4T1G084QF-BIF7 K4T1G084QF-BIF7 K4T1G084QF-BIF7 SAMSUNG TSOP 23+ 2056 View
K4A4G165WE-BCPB K4A4G165WE-BCPB K4A4G165WE-BCPB SAMSUNG TSOP44 23+ 2056 View
KM684002J-17 KM684002J-17 KM684002J-17 SAMSUNG NA 23+ 2052 View
KLMAG2WE4A-A001 KLMAG2WE4A-A001 KLMAG2WE4A-A001 SAMSUNG QFP 23+ 2052 View
K9K1208UOA-YIBO K9K1208UOA-YIBO K9K1208UOA-YIBO SAMSUNG BGA 23+ 2052 View
KBE00500AA-D437 KBE00500AA-D437 KBE00500AA-D437 SAMSUNG TSOP 23+ 2052 View
KM62256CLTGE KM62256CLTGE KM62256CLTGE SAMSUNG BGA 23+ 2052 View
KM44C256CP-6 KM44C256CP-6 KM44C256CP-6 SAMSUNG NA 23+ 2052 View
KM416S1020CT-G8 KM416S1020CT-G8 KM416S1020CT-G8 SAMSUNG BGA 23+ 2052 View