SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
K4AAG165WA-BCWE	SAMSUNG	BGA	23+	2628	View
K7K3236T2C-EC40	SAMSUNG	BGA	23+	2628	View
K9F5608UOB-PCBO	SAMSUNG	TSOP-40	23+	2624	View
K9F1G08U0A-PCB0	SAMSUNG	TSOP-40	23+	2624	View
K4E641612E-TP50	SAMSUNG	TSOP	23+	2624	View
KM681001BSJ-15	SAMSUNG	BGA	23+	2624	View
K7N643645M-PC16	SAMSUNG	TSOP	23+	2624	View
K7R161882B-FC20	SAMSUNG	TO-126F	23+	2624	View
KM684000BLP-7	SAMSUNG	TSOP48	23+	2620	View
K9F1G08UOD-SIBO	SAMSUNG	SOJ44	23+	2620	View
K4T51163QE-ZCD5	SAMSUNG	BGA	23+	2620	View
K4E160812D-BC50	SAMSUNG	DIP24	23+	2618	View
K4W1G1646E-HC11	SAMSUNG	BGA	23+	2618	View
K4M56323LG-HN75000	SAMSUNG	BGA	23+	2618	View
K4T1G164QG-BCE7	SAMSUNG	SOP-8	23+	2618	View
K4B4G0846D-BCKO	SAMSUNG	TSOP48	23+	2618	View
K4B2G1646B-HCH9	SAMSUNG	BGA	23+	2618	View
K4D261638I-LC50	SAMSUNG	NA	23+	2618	View
KM416C256J-7	SAMSUNG	TFBGA221	23+	2616	View
K9F2808U0C-PCB0	SAMSUNG	FBGA	23+	2616	View

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