SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
CL03C100DA3GNNC	SAMSUNG	TSOP	23+	1860	View
CL21B224KBFNNNF	SAMSUNG	TSOP54	23+	1860	View
CL03A683KQ3NNNC	SAMSUNG	BGA	23+	1860	View
CL21B332KBANNNC	SAMSUNG	TSOP54	23+	1860	View
CL05A106MQ5NNNC	SAMSUNG	TSOP54	23+	1860	View
CIGT252010LMR33MNE	SAMSUNG	BGA	23+	1860	View
S3C1860XL5-SK91	SAMSUNG	BGA	23+	1860	View
S2DOS04A01-J030	SAMSUNG	BGA-216	23+	1860	View
S24CS08A	SAMSUNG	FBGA	23+	1856	View
TCSCS0J226MAAR	SAMSUNG	SOJ	23+	1852	View
LJ13-01458A	SAMSUNG	FBGA	23+	1848	View
LAU4141T0B-B	SAMSUNG	FBGA	23+	1848	View
M471A5244CB0-CTD	SAMSUNG	BGA	23+	1848	View
S2MPA01X01-6030	SAMSUNG	BGA	23+	1848	View
TCSCS0G106MAAR	SAMSUNG	FBGA	23+	1848	View
S5D2509X06-DO	SAMSUNG	BGA	23+	1848	View
S5C7221X01-V070	SAMSUNG	BGA	23+	1848	View
S3C2410X01-YORO	SAMSUNG	TSOP54	23+	1848	View
S3F880AXZZ-QZRA	SAMSUNG	TSOP54	23+	1848	View
S3C2412X20-Y080	SAMSUNG	FBGA	23+	1848	View