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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
CXP5024H-060 CXP5024H-060 CXP5024H-060 SAMSUNG TSOP54 23+ 1912 View
TCSVS1V105MAAR TCSVS1V105MAAR TCSVS1V105MAAR SAMSUNG FBGA96 23+ 1912 View
SE1159LMHL-NT SE1159LMHL-NT SE1159LMHL-NT SAMSUNG sop 23+ 1912 View
SQ3D01600B2HBA SQ3D01600B2HBA SQ3D01600B2HBA SAMSUNG BGA 23+ 1912 View
S5L9286F01-00 S5L9286F01-00 S5L9286F01-00 SAMSUNG FBGA 23+ 1912 View
S5L9275X01-TO S5L9275X01-TO S5L9275X01-TO SAMSUNG TSOP 23+ 1912 View
S5E4412AC0-LA40 S5E4412AC0-LA40 S5E4412AC0-LA40 SAMSUNG NA 23+ 1912 View
S3C4510B01-QE80 S3C4510B01-QE80 S3C4510B01-QE80 SAMSUNG TSOP54 23+ 1912 View
S3F8289XZZ-QW89 S3F8289XZZ-QW89 S3F8289XZZ-QW89 SAMSUNG FBGA 23+ 1912 View
S3C2510A01-GB80 S3C2510A01-GB80 S3C2510A01-GB80 SAMSUNG TSOP54 23+ 1912 View
S3F9454BZZ-SKB4 S3F9454BZZ-SKB4 S3F9454BZZ-SKB4 SAMSUNG BGA 23+ 1912 View
CIM31J102NE CIM31J102NE CIM31J102NE SAMSUNG BGA 23+ 1912 View
S1M8837X01 S1M8837X01 S1M8837X01 SAMSUNG FBGA 23+ 1912 View
CL31B334KBFNFNE CL31B334KBFNFNE CL31B334KBFNFNE SAMSUNG TSOP56 23+ 1912 View
CL10C360JB8NNNC CL10C360JB8NNNC CL10C360JB8NNNC SAMSUNG BGA 23+ 1912 View
CL31B225KBHNFNE CL31B225KBHNFNE CL31B225KBHNFNE SAMSUNG TSOP 23+ 1912 View
CL10B224KO8NNNC CL10B224KO8NNNC CL10B224KO8NNNC SAMSUNG BGA 23+ 1912 View
CL21B102KBANFNC CL21B102KBANFNC CL21B102KBANFNC SAMSUNG BGA 23+ 1912 View
CL31A106KOHNNNE CL31A106KOHNNNE CL31A106KOHNNNE SAMSUNG BGA 23+ 1912 View
CL10B472KC84PEL CL10B472KC84PEL CL10B472KC84PEL SAMSUNG TSOP 23+ 1912 View