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SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
SPMWH1228FD5WAPMS3 SPMWH1228FD5WAPMS3 SPMWH1228FD5WAPMS3 SAMSUNG BGA 23+ 2304 View
S5C7376X01-Y070 S5C7376X01-Y070 S5C7376X01-Y070 SAMSUNG BGA 23+ 2304 View
S524A40X21-SC70 S524A40X21-SC70 S524A40X21-SC70 SAMSUNG BGA 23+ 2304 View
S3F84YBXZZ-TW8B S3F84YBXZZ-TW8B S3F84YBXZZ-TW8B SAMSUNG BGA 23+ 2304 View
S3F833BXZZ-QX8B S3F833BXZZ-QX8B S3F833BXZZ-QX8B SAMSUNG BGA 23+ 2304 View
S3C9404D13-AVB4 S3C9404D13-AVB4 S3C9404D13-AVB4 SAMSUNG BGA 23+ 2304 View
S3C2443XL-53 S3C2443XL-53 S3C2443XL-53 SAMSUNG BGA 23+ 2304 View
CIL21Y100KNE CIL21Y100KNE CIL21Y100KNE SAMSUNG BGA 23+ 2304 View
S1L9223A01-QO S1L9223A01-QO S1L9223A01-QO SAMSUNG BGA 23+ 2304 View
CL31B125KPCNNNC CL31B125KPCNNNC CL31B125KPCNNNC SAMSUNG BGA 23+ 2304 View
CL31B224KBFNNNE CL31B224KBFNNNE CL31B224KBFNNNE SAMSUNG BGA 23+ 2304 View
CL21C150JBANNNC CL21C150JBANNNC CL21C150JBANNNC SAMSUNG BGA 23+ 2304 View
CL05C200JB5NNNC CL05C200JB5NNNC CL05C200JB5NNNC SAMSUNG BGA 23+ 2304 View
CL02A103KQ2NNNC CL02A103KQ2NNNC CL02A103KQ2NNNC SAMSUNG BGA220 23+ 2304 View
CL21B104KBCNNNC CL21B104KBCNNNC CL21B104KBCNNNC SAMSUNG BGA 23+ 2304 View
CL05B104KO5NNNC CL05B104KO5NNNC CL05B104KO5NNNC SAMSUNG BGA 23+ 2304 View
CIGT252010LMR47MSE CIGT252010LMR47MSE CIGT252010LMR47MSE SAMSUNG BGA-253 23+ 2304 View
S3F9444XZZ-SC94 S3F9444XZZ-SC94 S3F9444XZZ-SC94 SAMSUNG BGA-216 23+ 2304 View
CL10B102KBNC CL10B102KBNC CL10B102KBNC SAMSUNG BGA 23+ 2304 View
S2MPS14X01-6030 S2MPS14X01-6030 S2MPS14X01-6030 SAMSUNG BGA 23+ 2300 View