SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
S1T8825B01-R0B0	SAMSUNG	TSOP32	23+	2388	View
CL10B332KB8NNNC	SAMSUNG	BGA	23+	2388	View
CL10B681KB8NNNC	SAMSUNG	TSOP	23+	2388	View
CL10A225KA8NN5C	SAMSUNG	TSOP-48	23+	2388	View
CL03A105MQ3CSNH	SAMSUNG	SSOP	23+	2388	View
CL10C070DB8ANNC	SAMSUNG	BGA	23+	2388	View
CL10B102KC8NNNC	SAMSUNG	FBGA	23+	2388	View
CL03A104KP3NNNC	SAMSUNG	BGA	23+	2388	View
CIH05T1N2SNC	SAMSUNG	BGA	23+	2388	View
3F80JBBZZ-S09B	SAMSUNG	TSOP48	23+	2388	View
SLSNNWH462USESRO	SAMSUNG	TSOP48	23+	2384	View
SC32442BL-43S	SAMSUNG	TSOP	23+	2380	View
SSNRII-2K5V1-4CD-E3TRY	SAMSUNG	FBGA	23+	2380	View
C6262LKA10	SAMSUNG	TSOP48	23+	2380	View
JUPITER4EPBB	SAMSUNG	SOP	23+	2380	View
SLSNNWH412TSDWBK	SAMSUNG	TSOP	23+	2380	View
S5L9279X01-TO	SAMSUNG	SOJ	23+	2380	View
S5C7221X01-VOTO	SAMSUNG	TSOP48	23+	2380	View
S3C44BOX01L	SAMSUNG	BGA	23+	2380	View
S3C2412X26-YO80 BGA	SAMSUNG	TSOP48	23+	2380	View