En
search
ACE
SAMSUNG
Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.
Heat distribution of products
Photo Type Brand Packaging Batch Inventory Operation
SE657MRH-LF SE657MRH-LF SE657MRH-LF SAMSUNG QFP 23+ 2544 View
TCSCS1C106KBAR TCSCS1C106KBAR TCSCS1C106KBAR SAMSUNG SOP8 23+ 2544 View
TCSCS1A476KBAR TCSCS1A476KBAR TCSCS1A476KBAR SAMSUNG SOP28 23+ 2544 View
DUPLEXER-SAW DUPLEXER-SAW DUPLEXER-SAW SAMSUNG FBGA 23+ 2544 View
S5PV310BH-B0 S5PV310BH-B0 S5PV310BH-B0 SAMSUNG TSOP 23+ 2544 View
S524C20D21-SCT S524C20D21-SCT S524C20D21-SCT SAMSUNG TSOP 23+ 2544 View
S3C2500B01-GABO S3C2500B01-GABO S3C2500B01-GABO SAMSUNG BGA 23+ 2544 View
S3C44B0X01 S3C44B0X01 S3C44B0X01 SAMSUNG 54TSOP 23+ 2544 View
S3C4530A01-QE80 S3C4530A01-QE80 S3C4530A01-QE80 SAMSUNG TSOP48 23+ 2544 View
S3P8249XZZ-QW89 S3P8249XZZ-QW89 S3P8249XZZ-QW89 SAMSUNG TSOP40 23+ 2544 View
S3C2451XH-53 S3C2451XH-53 S3C2451XH-53 SAMSUNG TSOP48 23+ 2544 View
CIC43P501NE CIC43P501NE CIC43P501NE SAMSUNG TSOP48 23+ 2544 View
S1M8662A01-Z070 S1M8662A01-Z070 S1M8662A01-Z070 SAMSUNG BGA 23+ 2544 View
CL21A475KPFNNWE CL21A475KPFNNWE CL21A475KPFNNWE SAMSUNG TSOP 23+ 2544 View
CL10B473KB8NFNC CL10B473KB8NFNC CL10B473KB8NFNC SAMSUNG TSOSP 23+ 2544 View
CL31B106KQHNNNE CL31B106KQHNNNE CL31B106KQHNNNE SAMSUNG BGA 23+ 2544 View
CL05A225K05NQNC CL05A225K05NQNC CL05A225K05NQNC SAMSUNG QFP 23+ 2544 View
CL05A105KO5NNND CL05A105KO5NNND CL05A105KO5NNND SAMSUNG QFP 23+ 2544 View
CL05C560JB5NNNC CL05C560JB5NNNC CL05C560JB5NNNC SAMSUNG BGA 23+ 2544 View
CL05C470JB51PNC CL05C470JB51PNC CL05C470JB51PNC SAMSUNG SMD 23+ 2544 View