SAMSUNG

ACE

Samsung Electronics products are widely used in DRAM, SRAM, flash memory, ASIC, CPU, TFF-LCD board etc. MAX FPGA GROUP is the distributor of many OEM chips from many famous manufacturers in the industry, to know more about OEM chips, please browse the following product categories.

Heat distribution of products

Type	Brand	Packaging	Batch	Inventory	Operation
SA57970X03H-N2DFNM	SAMSUNG	BGA	23+	3000	View
S3P863AXZZ-AQ9A	SAMSUNG	BGA	23+	3000	View
S1A0427B01-D0	SAMSUNG	BGA	23+	3000	View
CL10C270JB8NNNC 0603 27P 50V	SAMSUNG	BGA	23+	3000	View
0805 226M 25V/X5R	SAMSUNG	BGA	23+	3000	View
S5M925DA01-L330	SAMSUNG	BGA	23+	3000	View
S1T8603X01-D0	SAMSUNG	BGA	23+	3000	View
CL05B473KA5VPNC	SAMSUNG	BGA	23+	3000	View
TOS1300VPM4DKB	SAMSUNG	TSOP	23+	2996	View
FEMEDXXBD6550HAX	SAMSUNG	SOP	23+	2992	View
SFR9220TF	SAMSUNG	DIP	23+	2988	View
CL05A104KO5NNNC	SAMSUNG	BGA	23+	2988	View
CL31B104KBCNNNC	SAMSUNG	BGA	23+	2988	View
TCSCS1A336MBAR	SAMSUNG	TSSOP	23+	2984	View
SFH942PS101	SAMSUNG	BGA	23+	2980	View
IFR3386P0T0SE21	SAMSUNG	TSSOP	23+	2976	View
SEMS21-LF	SAMSUNG	FBGA	23+	2976	View
S524A40X21-RC70	SAMSUNG	S0P	23+	2976	View
S3C80G9B24-SN99	SAMSUNG	FBGA	23+	2976	View
CL10B224KB8NNNC 220NF 50V X7R	SAMSUNG	BGA	23+	2976	View